|
|
ER-2 Doppler Radar - Data System Electronics
Enclosure
Time period
May 2001 to June 2001
Project description
The Electronics Enclosure was designed and
built for a Doppler Radar instrument that is housed in the nose
of the NASA ER-2 high altitude research aircraft. The system
had a previous design for an enclosure to hold its data processing
electronics. The old design was difficult to install, did not
provide an adequate thermal environment for the electronics,
and was not asthettically pleasing.
The old design had an outer skin that was
bolted to hard points in the nose of the ER-2. The electronics
were then slid into and bolted to the outer skin. The new design
shown is built around a standard off the shelf card rack (shown
in orange in the middle of the enclosure). The main body of the
enclosure is 19.9 inches (50.5 centimeters) wide x 11.9 inches
(30.2 centimeters) tall x 12.25 inches (31.1centimeters) deep
to approximately match the existing enclosure. The mounting "ears"
on the side increase the overall width to 23.9 inches and these
attach the enclosure to the mounting points in the ER-2 nose.
This design allows all of the electronics to remain enclosed
and gives easy access to the mounting points.
The previous design continuously pulled very
cold air into the box from the outside environment. This was
done in anticipation that the electronics would need to be cooled
and if they needed to be heated, approximately 100W of heat could
be added to the incoming air through heaters. However, it was
learned that the electronics were being cooled below freezing
even with the extra heating. This was not a problem during operation
since there is little moisture at the operating altitude above
60,000 feet. |

Isometric view of the Electronics Box structure
The box is 19.9"W x 11.9"H x 12.25"D
Isometric view of the box with cover
sheets removed

EDOP Enclosure installed in the ER-2 |
|
|
However, as the aircraft descended, the cold
electronics would allow water to condense. This could cause electrical
short circuits. The new design seals the internal electronics
from the outside air. The internal air is very well circulated
in order to cool hot spots and heat cold spots using convection.
The new design should keep the electronics warm enough to eliminate
the previous condensation problems.
The customers for this project are pleased
with the appearance of the new design. Therefore, the asthetic
requirements have been met.
Challenges and lessons learned
This project was my first large scale test
for eliminating conventional 2Dimension shop drawings for fabrication.
All of the machining is performed using just the 3D computer
models for generation of the CNC code. This speeds the product
development process and reduces costs. |